Platform Computing HPC* 3.1 Intel® Cluster Ready on RHEL* 6.2 - Intel® Server Board S2600JF

This Intel® ESAA recipe describes the steps required to build a Platform Computing HPC* 3.1 and Intel® Cluster Ready HPC cluster based upon the Intel® Server Board S2600JF - from hardware assembly through performance testing and cluster application development. It includes various options for hardware design, interconnects, management, BIOS and OS provisioning, job schedulers, cluster tools and cluster application development packages and runtime environments. It also includes instructions for Intel® Cluster Ready Pass-Through Certification.

The Intel® Server Board S2600JF is ideal for HPC applications. Performance 2S half width board optimized for memory throughput. Supports dual Intel® Xeon® E5-2600 processors with Intel® TXT Technology for demanding compute environments and includes Intel® TXT Technology. Half-width form factor for high density racks, (6.42 inches wide, 4 nodes in 2U). Intel technology and rich feature set maximizes price and performance, including advanced hot swap and storage interface options, and ConnectX-3 Infiniband* QDR or FDR onboard. Performance 8 channel memory at 1600 MHz for maximum memory bandwidth (56 PCIe Gen3* I/O lanes). The Intel® Xeon® processor E5-2600/1600 product families are at the heart of a flexible and efficient data center that meets your diverse needs. These engineering marvels are designed to deliver the best combination of performance, built-in capabilities, and cost-effectiveness. From virtualization and cloud computing to design automation or real-time financial transactions, you’ll be delighted by better than ever performance.  I/O latency is dramatically reduced with Intel® Integrated I/O, which helps you to eliminate data bottlenecks, streamline your operations, and increase your agility. The Intel® Xeon® processor E5-2600/1600 product families – versatile processers at the heart of today’s data center.